With electronic device dimensions downscaling to prohibitive values, new materials show promise to improve performance and power consumption. Much improvement is required to dethrone silicon-based technologies. Integrating the best of both worlds is an interesting alternative with multiple challenges. Interests include device and circuit reliability, RF/mmW applications, CMOS circuits, sensors and neuromorphic applications through monolithic integration of novel materials into silicon platforms.

Physical Science and Engineering Division (PSE)

CMOS design RF Neuromorphic Electrical characterization Integration Electron devices